Principal Engineer/Sr. Principal Engineer Rf Microwave Design Md

Requisition ID:
R10162336
Category:
Engineering
Location:
Baltimore, Maryland, United States of America
Clearance Type:
Interim Secret
Telecommute:
No- Teleworking not available for this position
Shift:
1st Shift (United States of America)
Travel Required:
Yes, 10% of the Time
Relocation Assistance:
Relocation assistance may be available
Positions Available:
2
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
NGMS engineers share a great sense of pride knowing their contributions have a direct effect on the safety and security of the country and its allies. Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to work to accomplish the mission while learning and having fun along the way. The Airborne Multifunction Sensors Engineering and Sciences (AMS E&
S) organization is fertile ground for all experience levels to become part of our growing team and contribute to our goals. The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions. AMS E&
S is seeking engineers with experience and interest in electronic assembly and packaging design.
Typical Roles and Responsibilities include:
Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies
Utilize analysis, simulations and prototyping to develop antenna designs including phased arrays
Deriving and trading requirements with subsystem engineers and component level designers
Managing RF budgets, frequency planning, and common assembly level interfaces
Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test
Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more
Supporting products throughout the product life cycle
RF and mixed signal product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver / exciter assemblies, signal conditioning assemblies, signal generators, and transmit / receive assemblies
Principal Engineer Basic Qualifications:
Electrical Engineering or related STEM field degree:
Bachelor of Science with 5 years of RF/microwave experience;
Master’s degree with 3 years of RF/microwave experience;
or PhD degree. an additional 4 years of experience will be consider in lieu of a degree
US Citizenship is required
Must obtain and maintain an interim secret clearance (minimum) prior to starting.
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.
Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to:
RF components &
assemblies, requirements development, EM and related modeling &
simulation, RF test verification, production test support, and design for producibility
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.E. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
Proven knowledge of electrical engineering design software and equipment
Senior Principal Engineer Basic Qualifications:
Electrical Engineering or related STEM field degree:
Bachelor of Science with 9 years of RF/microwave experience;
Masters degree with 7 years of RF/microwave experience;
PhD degree with 4 yearsof experience. An additional 4 years of experience will be consider in lieu of a degree.
US Citizenship is required.
Must obtain and maintain an interim secret clearance (minimum) prior to starting.
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.
Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to:
RF components &
assemblies, requirements development, EM and related modeling &
simulation, RF test verification, production test support, and design for producibility
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.E. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
Proven knowledge of electrical engineering design software and equipment.
Preferred Qualifications for both Principal and Senior Principal roles:
Secret or Top Secret / SCI security clearance
RF and mixed signal printed circuit board and circuit card assembly level design
RF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysis
Component selection and/or custom component requirements flow down and trades
Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip
RF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.
Electronic troubleshooting from component to assembly levels
Complex data reduction and analysis
Product life cycle support from concept through production support
Designing for high reliability, mil/aero requirements and environments
AESA / phased array, Radar, SIGINT, or SATCOM experience
Technical team leadership
Experience in the Aerospace or Defense Industry
Software tools:
Mentor Xpedition DX Designer, ANSYS HFSS, Keysight ADS, Keysight Genesys, MathWorks MATLAB, Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)
Role is contingent on candidate's ability to obtain and maintain an Interim Secret Clearance and Program Award.
Salary Range:
$102,400 - $153,600
Salary Range 2:
$127,000 - $190,600
The above salary range represents a general guideline;
however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
--s-p-m1--
By applying, you consent to your information being transmitted by Monster to the Employer, as data controller, through the Employer’s data processor SonicJobs.
See Northrop Grumman Terms &
Conditions at northropgrumman and Privacy Policy at https:
//www.Northropgrumman.Com/who-we-are/privacy-policy and SonicJobs Privacy Policy at https:
//www.Sonicjobs.Com/us/privacy-policy and Terms of Use at https:
//www.Sonicjobs.Com/us/terms-conditions